Industrial sector
Labels for the electronics industry
We supply resistant self-adhesive labels for electronics: they withstand the reflow soldering oven up to +300 °C, resist cleaning with isopropanol (IPA), comply with RoHS and work in ESD environments, with a DataMatrix code readable by machine vision for PCB traceability. Small, precise and dimensionally stable. Since 1994 we have supplied identification to the electronics industry in Spain and Europe.
Temperature
Up to +300 °C
Standards
RoHS · ESD
Resistance
IPA · Solvents
Traceability
DataMatrix · PCB
Common materials in electronics
Do you have a specific soldering or cleaning process?
Tell us the oven thermal profile, the cleaning solvent and the label format you need. We validate with a sample before production.
Consult for electronics →Environment and technical requirements
In electronics, the label cannot be a point of failure in the process. The reflow oven, the solvent bath and the ESD environment are critical control points: if the label lifts, melts or generates an electrostatic discharge, the component or board can be rendered unusable.
Where our labels are used
From the microcomponent on the pick-and-place tape to the finished board in the shipping warehouse, the traceability label accompanies the PCB at every point in the manufacturing process.
Specific applications
Labels applied to PCBs before the reflow soldering process must withstand the full thermal profile of the SMT oven — including the peak temperature — without melting, warping or releasing adhesive onto the components or circuit traces.
High temperature ARGIPRINT° · Up to +300 °C · No migration
In EPA (Electrostatic Protected Area) zones, the label must have dissipative properties: it must not generate or accumulate electrostatic charge that could damage CMOS, MOSFET or microchip components when handled. ESD materials have controlled surface resistance to ANSI/ESD S20.20.
Dissipative ESD · ANSI/ESD S20.20 · Controlled surface resistance
Individual traceability of boards and components requires small-format labels with a DataMatrix code readable by an industrial camera. The code must retain contrast and readability after soldering, cleaning and handling, with a high read rate on machine-vision systems.
From 6×6 mm · DataMatrix · Machine vision
Cleaning residual flux with isopropanol, acetone or ultrasonic processes is common after soldering. Polyester labels with resin ribbon keep their adhesion and code readability after the bath. The material does not dissolve, and the print does not smear on contact with these solvents.
Polyester · Resin ribbon · IPA · Solvents
Technical material families
The choice of substrate depends on the properties the process demands of the material: thermal stability, surface resistance, chemical resistance. These are the most common technical families in this sector.
Material
The common material when dimensional stability, good print quality and durability in technical identification are needed. Polyester is inert to IPA, acetone and cleaning solvents typical in electronics manufacturing.
Material
Technical constructions formulated to withstand intense heat without deforming or releasing gases. The ARGIPRINT° range and polyimide are the reference substrates when the manufacturing process or the environment of use demands high-temperature stability.
Material variant
A polyester variant with a dissipative property built into the substrate: the surface resistance is controlled so the label does not generate or accumulate electrostatic charge in EPA zones. Meets ANSI/ESD S20.20 requirements.
Sector needs and processes
Label choice in electronics doesn't depend on the material alone: the manufacturing process, the type of component, traceability needs and the environment of use all play a part. These are the sector's most common needs.
Application
Solutions to identify and track boards, subassemblies and components through manufacturing, quality control or service. The code must remain readable after every process in the cycle.
Application
Applications for components or processes where thermal cycles or manufacturing stages demand stable, legible identification. Temperature isn't the only factor: the thermal profile, exposure time and the specific process all matter too.
Application
Solutions to control opening, integrity or evidence of tampering on sensitive components, equipment or packaging. Especially relevant for warranted equipment, high-value assets or components that must not be accessed without authorisation.
Regulations and sector requirements
Electronics is subject to strict regulations on hazardous materials (RoHS), electrostatic protection (ESD) and manufacturing processes. Labels are part of the system and must meet the same requirements as the component they're applied to.
The RoHS Directive restricts the use of lead, mercury, cadmium, hexavalent chromium, PBDE and PBB in electrical and electronic equipment. Labels applied to this equipment must be compliant: the material, adhesive and ink must not contain these substances above the established thresholds.
International standard for controlling static electricity in electronics manufacturing environments (EPA). It defines the surface resistance requirements for materials used in ESD-protected zones. Dissipative labels must have surface resistance within the specified range so as not to generate or accumulate charge that could damage components.
Individual traceability of boards and components with a DataMatrix code requires the code to maintain its quality parameters (contrast, decodability, uniformity) after every manufacturing process. IPC standards and the customer's MES system define the code quality requirements.
SMT reflow ovens have specific thermal profiles depending on the process: SAC305, SnPb or others. The label must be validated with the customer's actual thermal profile to confirm it withstands every segment of the cycle, including the peak and cooling, without deforming or adhesive migration.
Frequently asked questions
For the reflow soldering process in an SMT oven, high-temperature labels based on polymer materials are used that withstand peaks of up to +300 °C without melting, warping or releasing adhesive. The ARGIPRINT° range is formulated for these processes. It is necessary to validate the customer's oven thermal profile to confirm compatibility.
An ESD label is a label with dissipative or conductive properties that does not generate or accumulate electrostatic charge when handled. It is needed in electronics manufacturing environments where ESD-sensitive components (MOSFETs, CMOS, microchips) can be irreversibly damaged by an electrostatic discharge. Surface resistance requirements are defined by the ANSI/ESD S20.20 standard.
Yes, with the right material and ribbon. Ultrasonic cleaning with isopropanol (IPA) or acetone is a common process in electronics manufacturing. Polyester labels with resin ribbon are the most resistant to these solvents: the material does not dissolve or deform, and the print does not smear. Tell us the specific solvent so we can validate the compatibility of the material-and-ink combination.
Yes. We supply labels from 6×6 mm with a DataMatrix or QR code readable by machine vision. At these sizes, code density, print contrast and dimensional tolerance are critical. The printing process must be calibrated to ensure the DataMatrix is readable on the customer's reading equipment.
The RoHS Directive restricts the use of certain hazardous substances in electrical and electronic equipment. Applied to labels, this means the material, adhesive and ink must not contain lead, mercury, cadmium, hexavalent chromium, PBDE or PBB above the established thresholds. We have a RoHS declaration of conformity available for the materials most commonly used in electronics.
To provide evidence that a unit has been opened or tampered with without authorisation, tamper-evident (VOID) labels are used with destructible adhesive or a security layer that leaves a visible message when removed. They are common on warranted equipment, high-value assets, batteries and control modules. The choice of material and adhesive depends on the surface type and the level of security required.
Yes. In electronics, where process conditions are very specific — oven thermal profile, cleaning solvent, ESD environment, code format — validating the solution with a sample before production is necessary. Tell us the process, the component or board, the label dimensions and the regulatory requirements so we can prepare the right sample.
Material
ARGIPRINT° and polyimide for SMT reflow up to +300 °C. Halogen-free, no adhesive migration. RoHS compliant and validated with an actual thermal profile.
See materialsApplication
DataMatrix from 6×6 mm for individual PCB and component traceability. Readable by machine vision after reflow, IPA cleaning and every process in the cycle.
See applicationApplication
Evidence of opening or an attempted removal on warranted equipment, high-value assets and sensitive components. Destructible adhesive or a visible security layer.
See applicationDirect contact
Tell us the process (reflow, ESD, solvents), the label format and the reading equipment. We validate with a sample before production.